- Product Range
- Single Side
» CEM - 1, CEM - 3, FR-1(0.4mm - 2.4mm)
- Double Side
» CEM - 3, FR - 4 0.4mm - 2.4mm)
- Multi Layer (4L)
» FR - 4 (0.6mm - 2.4mm)
The product ranges are covered by UL
E82350(S)
- Variable Surface Finisher Available...
- Hot Air Solder Leveling (HASL)
- Electronic Gold Plating (0.5µ"), Immersion
Gold (5µ"), Tab Gold (10µ")
- Carbon / Peelable Printing
- Organic Surface Coating, Cu Preservatives (flux
coating)
- Design and Dimension
- Min. line width / space [6/6 mils]
- Min. annular ring [5 mils]
- Min. Hole size [10 mils (0.25mm)]
- Min. SMD Pitch [25 mils]
- Min. solder dam between SMD [5 mils]
- Hole location [±2 mils]
- General mechanical tolerance [±5 mils]
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