| Test
Analysis |
Process
Location |
Freq. |
Simple
Size |
Test
Equipment |
Remarks |
| A. PRODUCT |
|
|
|
|
|
| _1. Plating & Ink __Thickness
__Measurement |
|
|
|
|
|
| 1.1 Microsection |
HAL
CuTL |
monthly
monthly |
1 sample/DC
1 sample/DC |
Microscope |
in-house |
| 1.2 Coating __Measurement |
CuTL/SES
HAL
NiAu Plating |
2x/month
2x/month
2x/month |
1 sample/DC
1 sample/DC
1 sample/DC |
CMI XRX MRX PTX
CMI XRX PTX
CMI XRX |
in-house
in-house
in-house |
| 2. Solderability |
|
|
|
|
|
| 2.1 CEMCO Rotary __solderability __Test |
FVI/FG |
2x/month |
1 sample/DC |
CEMCO Rotary solderability Test |
in-house |
| 2.2 HAL |
FVI/FG |
2x/month |
1 sample/DC |
TIM HAL Machine |
in-house |
| 3. Plating __Adhesion Test |
PTH
CuTL
Tab Plating |
2x/month
2x/month
2x/month |
1 sample/DC
1 sample/DC
1 sample/DC |
3M Cellophane Tape 600
|
in-house
in-house
in-house |
| 4. Marking Paints & __Inks Adhesion __Test |
LPSM
Legend
FVI |
2x/month
2x/month
2x/month |
1 panel/DC
1 panel/DC
1 panel/DC |
3M Cellophane Tape 600
|
in-house
in-house
in-house |
| 5. Ionic __Contamination __Test |
OQA |
2x/month |
1 sample/DC |
SMD 600 Omega Meter |
in-house |
| 6. soldermask Ink __Hardness Test |
LPSM |
2x/month |
1 panel/DC |
Staedler Pencil 1H-6H |
in-house |
| 7. Practice Test __Count |
DF Imaging
LPSM |
2x/month
2x/month |
N/A
N/A |
Laser Particle Counter |
in-house
in-house |
| B. PROCESS. |
|
|
|
|
|
| 1. Solder Bath __Analysis |
HAL |
|
|
|
|
| _Cu contamination _level |
|
monthly |
500 grams |
Spark Emission |
outside |
| 2. Additive Level |
CuTL |
|
|
|
|
| __2.1 Copper |
|
2x/month |
200 ml |
CVS |
outside |
| __2.2 Copper |
|
2x/month |
250 ml |
Hull Cell |
in-house |
| __2.3 Tin Lead |
|
2x/month |
250 ml-1 liter |
|
outside |
3. Cu __Contamination/
Concentration |
|
|
|
|
|
| 3.1 Black Oxide |
Black Oxide |
|
|
Titration |
in-house |
| __Microetch ______Solution |
|
< 50g/liter |
1 ml |
|
in-house |
| 3.2 Desmear Line |
Desmear |
|
|
AA Machine / Titration |
in-house |
| __Neutralizer ______Solution |
|
< 10g/liter |
5 ml |
|
|
| 3.3 PTH Line |
PTH |
|
|
|
|
| _3.3.1 Microetch |
|
< 50g/liter |
1 ml |
AA Machine / Titration |
in-house |
| 3.4 OMIG _Microetch |
CuTL |
130,00 SF |
N/A |
N/A |
in-house |
| 3.5 Etching |
SES |
<22oz/gal |
1 ml |
AA Machine / Titration |
in-house |
| _Ammonical ____Etchant |
|
|
|
|
|
| 3.6 Ni/Au |
|
|
|
|
|
| _Ni Bath |
TAB |
if necessary |
10 ml |
AA |
in-house |
| _Au Bath |
TAB |
if necessary |
10 ml |
AA |
in-house |
| 4. Palladium _Concentraion |
PTH |
daily |
10 ml |
Pico Pd Analyzer |
in-house |
| 5. Copper _Concentration |
CuTL |
daily |
5 ml |
Titration |
in-house |
| 6. Sulfuric Acid _Concentration |
CuTL |
daily |
5 ml |
Titration |
in-house |
| 7. Chloride Molarity |
SES |
every other day |
50 ml |
Titration |
in-house |
| 8. Acid to Copper ___Ratio |
CuTL |
|
N/A |
Computation |
in-house |
| 9. Carbon ___Treatment |
CuTL |
every 6 mos. |
All Copper Solution |
|
in-house |
| 10. Ni _Concentration |
TAB |
every 2-4 hrs. |
2 ml |
Titration |
in-house |
| _Au Concentration |
TAB |
if necessary |
10 ml |
AA |
in-house |
